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A Journey into Flatland: A Novel Approach to Meeting the Planarization Requirements of Advanced Lithography
A Journey into Flatland: A Novel Approach to Meeting the Planarization Requirements of Advanced Lithography
Planarization is a critical step in advanced lithography, needed to minimize CD uniformity (CDU) and edge placement error (EPE) because of the small depth of focus (DOF) and lack of telecentric imaging in leading edge exposure tools. Nonuniformities in pattern densities and pre-existing wafer topography can make it difficult to achieve the single-digit nanometer planarity required.
To address these challenges, we have developed Inkjet-based Adaptive Planarization (IAP) – a nanoimprint-like process – that can be used to remove pattern topography. The planarization performance of IAP is largely independent of the lateral length scale of the underlying topography of an incoming wafer. The IAP process uses an inverse optimization scheme, built around a validated fluid mechanics-based forward model that takes the pre-existing substrate topography and pattern layout as inputs and generates an inkjet drop pattern with a material distribution matched to the desired planarization film profile. This allows a contiguous film to be formed with the desired thickness variation that compensates for the pre-existing wafer topography and any parasitic signatures caused by the pattern layout. In this presentation, we will discuss the IAP process and planarization results, the properties of materials designed specifically for IAP, and concepts for IAP tools that can deliver the throughputs needed for volume manufacturing.
Date & Time
28 August 2026
8:00 AM, PT
Planarization is a critical step in advanced lithography, needed to minimize CD uniformity (CDU) and edge placement error (EPE) because of the small depth of focus (DOF) and lack of telecentric imaging in leading edge exposure tools. Nonuniformities in pattern densities and pre-existing wafer topography can make it difficult to achieve the single-digit nanometer planarity required.
To address these challenges, we have developed Inkjet-based Adaptive Planarization (IAP) – a nanoimprint-like process – that can be used to remove pattern topography. The planarization performance of IAP is largely independent of the lateral length scale of the underlying topography of an incoming wafer. The IAP process uses an inverse optimization scheme, built around a validated fluid mechanics-based forward model that takes the pre-existing substrate topography and pattern layout as inputs and generates an inkjet drop pattern with a material distribution matched to the desired planarization film profile. This allows a contiguous film to be formed with the desired thickness variation that compensates for the pre-existing wafer topography and any parasitic signatures caused by the pattern layout. In this presentation, we will discuss the IAP process and planarization results, the properties of materials designed specifically for IAP, and concepts for IAP tools that can deliver the throughputs needed for volume manufacturing.
To address these challenges, we have developed Inkjet-based Adaptive Planarization (IAP) – a nanoimprint-like process – that can be used to remove pattern topography. The planarization performance of IAP is largely independent of the lateral length scale of the underlying topography of an incoming wafer. The IAP process uses an inverse optimization scheme, built around a validated fluid mechanics-based forward model that takes the pre-existing substrate topography and pattern layout as inputs and generates an inkjet drop pattern with a material distribution matched to the desired planarization film profile. This allows a contiguous film to be formed with the desired thickness variation that compensates for the pre-existing wafer topography and any parasitic signatures caused by the pattern layout. In this presentation, we will discuss the IAP process and planarization results, the properties of materials designed specifically for IAP, and concepts for IAP tools that can deliver the throughputs needed for volume manufacturing.
Date & Time
28 August 2026
28 August 2026
8:00 AM, PT
Presenter:
Presenter:
Doug Resnick
Doug Resnick
Canon Nanotechnologies, Inc.
Canon Nanotechnologies, Inc.